The Rockford Area Economic Development Council (RAEDC) creates connections in multiple ways, one of which are Trade Delegations. Throughout 2020 and into 2021 this method of creating business connections has allowed our region to connect to multiple countries in many of our industry clusters.
The RAEDC is working with the Inverness Chamber of Commerce and the Scottish North American Business Council to extend an invitation to businesses within the Rockford Region to participate in a Virtual Trade Mission from March 22 – 25th.
“Through our continuous outreach and networking efforts, countries, organizations, and delegations have become aware of the value and exceedingly high skill-set our region’s companies possess. Working together with these global organizations is advantageous for all parties to the partnerships. These trade missions strengthen relationships while providing new connections and opportunities for Foreign Direct Investment (FDI) that can further benefit our region and the companies located here,” states Stephanie Jones, VP of Sales at the RAEDC.
In October the auto industry had the opportunity to connect with the Polish Investment and Trade Agency (PAIH), the Polish Automotive Industry Association, the Polish Automotive Group, the Polish Chamber of Automotive Industry, and the Association of Automotive Parts Distributors and Producers to create international connections for our auto manufacturing industry cluster.
This was the second event with the Polish Investment and Trade Agency located in Chicago, the first being with a Polish Software and Design Company in 2019.
The Rockford Region’s world-class infrastructure, which includes foreign trade zone #176 and the Chicago Rockford International Airport, allows international companies to reach their global customers and operations seamlessly.
The continuation of these trade missions develops international connections and opportunities for our region. Visit RockfordIL.com/events to register for the upcoming Scottish Trade Delegation happening in March.